- Automated Fluid Dispensing Systems for solder paste, solder mask, encapsulant and adhesive.
- Plasma Treatment System
- For Semiconductor, Wafer Level Packaging, Printed Circuit Board and Life Science industries
- X-ray Inspection System
- Up to 70 degree oblique angle views
- Uninterrupted rotating live oblique views 360 degrees around any point in the sample
- Nordson Dage XM8000
- Fast Automatic X-ray Measurement of TSVs, MEMS and Wafer Bumps for Voiding, Fill Level, Overlay & Other Critical Dimensions
- Automated Optical Inspection for Microelectronics
- Megapixel color imaging
- High magnification top-down viewing camera
- Acid & Alkaline Cleaning
- Photo-resist stripping
- Tin and tin/ lead stripping
- Dry film developing
- Acid and alkaline etching
- Dicing Saws, Wafer Cleaning System, Semi Auto Wafer Mounting System, Manual Wafer Mounting System, Tape Curing Systems, Dcing Saw Spindle Chiller
- Conventional Time/ Pressure Controlled Dispensers
- Adaptable for all types of fixed volume dispensing
- Lasermarking Systems
- Post Wire Bond Inspection
- High Speed Tape and Reel
- UV Wafer Eraser Machine
- Wafer Transfer Equipments
- Wafer Handling Robots
- Fully Automated Wafer Bumping Systems
- Patented Vibration Squeegee Technology
- Probe Stations
- Manual, Semi-Auto, Fully Auto, Magnetic, Laser Cutting Prober, Accessories and Customer Systems
- SMT Taping, Lead Trimming, Parts Counting and Peel Force Testing
 
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