- Automated Fluid Dispensing Systems for solder paste, solder mask, encapsulant and adhesive.
- Plasma Treatment System
- For Semiconductor, Wafer Level Packaging, Printed Circuit Board and Life Science industries
- X-ray Inspection System
- Up to 70 degree oblique angle views
- Uninterrupted rotating live oblique views 360 degrees around any point in the sample
- Automated Wafer Inspection and Metrology Systems
- Outstanding 2D and 3D capabilities in a versatile and flexible platform
- Tape and Reel and Mass Lead Trimming Equipments
- Trim & Form Systems
- High throughput
- Compact size
- Modular design
- Reject unit sorting
- Critical & Precision Cleaning Systems
- Ultrasonic Cleaning Systems
- Vapor Degreasers
- Lasermarking Systems
- Post Wire Bond Inspection
- High Speed Tape and Reel
- UV Wafer Eraser Machine
- Wafer Transfer Equipments
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